Scientists from Singapore's Nanyang technological University and the Korea Institute of Machinery and Materials (KIMM) have developed a technology to make highly uniform and scalable semiconductor wafers, paving the way for higher chip production and more cost-effective semiconductors. An2 ednc
The manufacture of semiconductor chips, which are common in smartphones and computers, has become difficult and complex, requiring highly advanced machines and special environments. An2 ednc
They are usually made on silicon wafers and then cut into small chips for equipment. Moreover, the process is not perfect, not all linings from the same wafer are painted as required. These defective chips are discarded, reducing semiconductor production and increasing production costs. An2 ednc
The ability to produce homogeneous wafers with the required thickness is the most important factor in ensuring the proper operation of each lining manufactured on the same wafer. An2 ednc
Transfer-based printing-- a process in which metal is printed on substrates by die pressure or "stamping"-- has become a promising technology in recent years because of its simplicity, relative cost efficiency and high production. An2 ednc
Moreover, the technology uses a chemical adhesive layer, which can lead to negative effects, such as surface defects and performance degradation during large-scale printing, as well as hazards to human health. For these reasons, the large-scale adoption of this technology and the subsequent application of chips in devices are limited. An2 ednc
In his study in the peer-reviewed journal ACS Nano, the team from NTU and KIMM reported that the newly developed nanotransfer printing technology forms a highly uniform wafer with nanowires by transferring gold (Au) special layers onto a silicon (Si) substrate at a low temperature (160C), which can be controlled to the thickness required during the manufacturing process. An2 ednc
This chemical-free printing technique works through direct chemical adsorption of heated contact with thin metal films-a chemical reaction that forms a strong bond between the surface of the substrate and the adsorbed material. An2 ednc
This is industrial compatibility technology that allows wafers to be manufactured quickly and evenly on a scale from Nami to inches. At the same time, there are few defects in the wafers, which means there are few or none of the chips lost because of poor performance. An2 ednc
In laboratory tests, the joint research team was able to transfer a 20 nm thick gold film to a 6-inch silicon wafer, thus achieving a yield transfer of more than 99%. This is the mainstream wafer size and Grover in the current production line of semiconductor chip manufacturers such as Samsung and Intel. This is the mainstream wafer size and Grosvender in the current production line of semiconductor chip manufacturers such as Samsung and Intel. This is the technology used in the pre-production line of semiconductor chip manufacturers such as Samsung and Intel that can be lightly magnified for 12-inch wafers. An2 ednc
When 6-inch wafers are fabricated by this method, the results show that the printing layer remains intact with minimal bending during engraving-which proves the outstanding unity and stability of the technology developed by NTU and KIMM. An2 ednc
In addition, when these 100 photodetectors, called photodetectors, are manufactured into a 6-inch wafer, they achieve outstanding performance uniformity, highlighting the great potential of the technology in commercial mass production. An2 ednc
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